It’s called “3D” because AMD layers the L3 (layer 3) cache on top of the existing CPU components, rather than making the CPU die bigger. By going vertical on the CPU, it’s now a “3d” design. (Other chip makers have done similar things with their own chips, and used the title “3d”)
CPUs keep a copy of some data normally in RAM inside its cache for faster access. This new design allows the cache to be much larger and maintain its speed. Applications that benefit from large caches will run really well on these CPUs, but they will use more power and get hotter. Also, on the CPUs with multiple processing dies only one has the 3D cache on it so the user or app must make sure it runs on the cores on the die that has the 3d cache to benefit from that.
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