The best analogy I can give you is putting screen protectors onto phones. Bubbles are the result of a tiny piece of dust that you cant see. That’s why it’s so hard to put a screen protector on without bubbles. Now imagine a Walmart sized warehouse where the entire place must not have a single spec of dust, and trying to put a warehouse sized screen protector onto a giant phone. That’s how difficult it is to build chips. The equipment is super sensitive. An extra microscopic drip of moisture in the air will result in a laser going off course and burning something in the wrong place. Equipment like this is super expensive, and years to build by hand. Even if you can put together a facility, you need to do it quickly enough where your equipment is not obsolete by the time it’s done. Someone will be the leader. TSMC is the leader today, but it may not alway be the case.
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